iPhone 7 : un coût de fabrication de 225 dollars
- 👨 Pierre Domenach
- Il y a 8 ans (Màj il y a 8 ans)
- 💬 18 coms
Les composants les plus chers sont l’écran (43$), le modem (33,90$), et la nouvelle puce A10 Fusion processeur A10 Fusion (26,90$). Le stockage de ne 32 Go et la RAM LPDDR4 de 2 Go coûterait à eux 2 seulement 16,40$.
| Apple iPhone 7 32GB (A1778) | |||
| Cost Summary | |||
| Direct Material Costs | 219.80 | ||
| (Component Costs) | |||
| Conversion Costs | 5.00 | ||
| (Assembly / Insertion / Test Costs) | |||
| Total Cost | 224.80 | ||
| (Direct materials and manufacturing) | |||
| Itemized Components | Manufacturer Name | Description | |
| Apps Processor | |||
| System-on-Chip | TSMC (Apple) | Apple A10, Quad-Core 64-Bit ARM Based CPU, Hexa-Core | 26.90 |
| GPU, 16nm FinFET | |||
| Baseband / RF / PA | 33.90 | ||
| Baseband | INTEL CORP | Baseband Processor, Multi-Mode | |
| RF Transceiver | INTEL CORP | RF Transceiver, Multi-Mode (Qty:2) | |
| RF Front End | |||
| Antenna Switch Module | TDK CORP | Antenna Switch Module, w/ Filters | |
| Antenna Switch Module | TDK CORP | Antenna Switch Module, w/ Filters | |
| Envelope Tracking | QORVO INC | Envelope Tracking IC | |
| FEM | BROADCOM LTD (AVAGO) | FEM | |
| FEM | SKYWORKS | FEM | |
| FEM | SKYWORKS | FEM | |
| PAM | BROADCOM LTD (AVAGO) | PAM | |
| PAM | BROADCOM LTD (AVAGO) | PAM | |
| PAM | QORVO INC | PAM | |
| PAM | SKYWORKS | PAM | |
| Battery | |||
| HUIZHOU DESAY | Li-Polymer, 3.8V, 1960mAh | 2.50 | |
| BT / GNSS / WLAN | 8.00 | ||
| BT / WLAN | UNIVERSAL SCIENTIFIC INDUSTRIAL | BT / WLAN Module | |
| GNSS | BROADCOM LTD | GNSS Receiver | |
| Front End | BT / WLAN & GNSS Front End | ||
| Cameras | 19.90 | ||
| Front FaceTime | 7MP BSI w/ Fixed Lens | ||
| Rear | 12MP BSI, w/ AutoFocus, & Optical Image Stabilization | ||
| Display | 43.00 | ||
| Display / Touchscreen Module | 4.7" 1334x750 LTPS IPS LCD, w/ In-Cell Touch | ||
| Electromechanicals | 16.70 | ||
| Taptic Engine | Taptic Engine | ||
| Other Electro-Mechanicals | Antennas, Connectors, Microphones, PCBs, Speakers, etc. | ||
| Glue Logic | 1.30 | ||
| LATTICE SEMICONDUCTOR | FPGA - iCE40 Ultra, 40nm | ||
| Mechanicals | 18.20 | ||
| Enclosure | Enclosure, Main, Bottom - Machined Aluminum | ||
| Other Mechanicals | Hardware, Labels, Insulators, Shielding, vents, etc. | ||
| Memory | 16.40 | ||
| NAND | SK HYNIX | 32GB NAND | |
| SDRAM | SAMSUNG SEMICONDUCTOR | 2GB LPDDR4 PoP | |
| Power Management | 7.20 | ||
| PMIC - Main | DIALOG SEMICONDUCTOR | PMIC - Main | |
| PMIC - RF | INTEL | PMIC - RF | |
| Others | Other PMICs, Transistors, Diodes, etc. | ||
| User Interface | 14.00 | ||
| Audio codec | CIRRUS LOGIC | Audio Codec | |
| Audio Amplifier | CIRRUS LOGIC | Audio Amplifier (Qty:3) | |
| NFC | NXP | NFC Controller | |
| Others | Interface Ics, discretes, passives, etc. | ||
| Sensors | |||
| Barometer | BOSCH SENSORTEC GMBH | Barometric Pressure Sensor | |
| e-compass | ALPS | Electronic Compass | |
| Other Sensors | Accelerometer, Gyroscope, Touch ID Fingerprint | ||
| sensor, ALS/Proximity sensor, etc. | |||
| Box Contents | 11.80 | ||
| Lightning Cable | USB to Lightning | ||
| Lightning to 3.5mm Audio Adapter | Audio Adapter, Lightning to 3.5mm Jack | ||
| Headset w/ Lightning Connector | Headset, Stereo, w/ Lightning Connector | ||
| Charger | Wall to USB Type A Jack, 5V, 1A | ||
| Boxes and Literatures | |||
Certains vont encore crier au scandal, mais il faut savoir que ce prix dérisoire ne tient absolument pas compte des frais liés à la conception, au développement, à la distribution et à la promotion de l'iPhone 7.
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